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Blind via PCB
Blind via, the outermost circuit layer is connected with the adjacent inner layer with an electroplated hole, which is called "blind via" because the opposite side cannot be seen.
a) All blind via holes will be filled with epoxy resin from the prepreg sheets. Usually we cannot see it just by eyes. It's closed with a virtually flat surface of the copper lid. The via hole should be 100% filled with resin, and the thickness of the copper wall should not be less than 13μm (0.5 mil).
b) Blind via holes are often specified with a finished diameter of 0.20 or 0.25 mm (8 or 10 mils), which means that the holes can be drilled by means of 0.3 mm (12 mils) drill bits.
1) Prototype, small runs and volume production.
2)Base material: FR-4, Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc;Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002,
PTFE F4B DK2.2, DK2.65 etc..
Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc.
3) Layer count: up to 32 layers
4) PCB thickness 0.5-6.0mm
5) Panel size 10 x 10mm to 450 x 580mm
6) Solder mask: Green, Blue, matt blue, yellow, white and red etc.
7) Surface finish: Immersion gold, HASL LF, Immersion tin, Immersion silver and OSP
8) Door to door shipment
9) IPC-Class-II / IPC-Class-III Standard
If you have requirements on the PCB's, please reply back to this email by your gerber files and I will get back to you ASAP.
Ivy Deng | Business development
Bicheng PCB | email@example.com |Material partners: Rogers, ITEQ, SHENGYI, TAIYO, KUANGSHUN
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Bicheng is located at Baoan, Shenzhen, China 518103.